
NTF3055-160
Preferred Device
Power MOSFET
2.0 Amps, 60 Volts
N–Channel SOT–223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Applications
http://onsemi.com
2.0 AMPERES
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Power Supplies
Converters
Power Motor Controls
Bridge Circuits
60 VOLTS
RDS(on) = 160 m W
N–Channel
D
MAXIMUM RATINGS (TC = 25 ° C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain–to–Source Voltage
VDSS
60
Vdc
G
Drain–to–Gate Voltage (RGS = 1.0 M ? )
Gate–to–Source Voltage
– Continuous
– Non–repetitive (tp ≤ 10 ms)
VDGR
VGS
60
± 20
± 30
Vdc
Vdc
Vpk
S
MARKING
Drain Current
DIAGRAM
– Continuous @ TA = 25 ° C
– Continuous @ TA = 100 ° C
– Single Pulse (tp ≤ 10 μ s)
Total Power Dissipation @ TA = 25 ° C (Note 1.)
Total Power Dissipation @ TA = 25 ° C (Note 2.)
Derate above 25 ° C
ID
ID
IDM
PD
2.0
1.2
6.0
2.1
1.3
0.014
Adc
Apk
W
W
W/ ° C
1
2
3
4
SOT–223
CASE 318E
STYLE 3
5160
LWW
Operating and Storage Temperature Range
TJ, Tstg
–55 to
175
° C
5160
= Device Code
L
= Location Code
Single Pulse Drain–to–Source Avalanche
Energy – Starting TJ = 25 ° C
EAS
65
mJ
WW
= Work Week
(VDD = 25 Vdc, VGS = 10 Vdc,
IL(pk) = 6.0 Apk, L = 10 mH, VDS = 60 Vdc)
PIN ASSIGNMENT
Thermal Resistance
° C/W
4 Drain
– Junction to Ambient (Note 1.)
– Junction to Ambient (Note 2.)
R θ JA
R θ JA
72.3
114
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
TL
260
° C
1. When surface mounted to an FR4 board using 1 ″ pad size,
(Cu. Area 1.127 in2).
2. When surface mounted to an FR4 board using minimum recommended pad
1
Gate
2
Drain
3
Source
size, 2–2.4 oz. (Cu. Area 0.272 in2).
ORDERING INFORMATION
Device
Package
Shipping
NTF3055–160T1
NTF3055–160T3
NTF3055–160T3LF
SOT–223 1000 Tape & Reel
SOT–223 4000 Tape & Reel
SOT–223 4000 Tape & Reel
? Semiconductor Components Industries, LLC, 2001
July, 2001 – Rev. 0
1
Publication Order Number:
NTF3055–160/D